Stress evolution mechanism and thermo-mechanical reliability analysis of copper-filled TSV interposer
نویسندگان
چکیده
منابع مشابه
Evaluation of the Thermo Mechanical Reliability of PTH Copper in PCBs
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ژورنال
عنوان ژورنال: Eksploatacja i Niezawodnosc - Maintenance and Reliability
سال: 2020
ISSN: 1507-2711
DOI: 10.17531/ein.2020.4.14